The Conventional BGA Rework Problems to Avoid
Ball Grid Array is referred to as BGA. BGA is becoming more popular in the PCB industry due to its high-density capabilities. The BGA rework also addresses the popularity of BGA. By connecting the ICs packages on the underside, the BGA technique reduces the density and makes the IC connection complete. The PCB layout becomes simpler as a result.
Despite the simplified outcome, the design process necessitates a high level of technical expertise.PCB parts must be removed or replaced in response to unusual circumstances. These might need to be removed, reinstalled, and then soldered again. In this case, Surface Mount Devices packages require BGA rework technique for service rework.
Benefits Of BGA Rework:
Based on the prior statement, you would believe that BGA rework is only emplo...